3rd International Conference on Integrated Functional nano Systems (nanoFIS) 2017 Graz

  • Conference Call
  • We have the plea­sure to invite you to the 3rd Inter­na­tional Con­fer­ence nanoFIS 2017 — Inte­grated Func­tional nano Sys­tems tak­ing place on Novem­ber 2224, 2017 in Graz, Aus­tria! nanoFIS 2017 is jointly organ­ised by the Mate­ri­als Cen­ter Leoben Forschung GmbH and Techkon­nex – High-​Tech Pro­mo­tion.

    nanoFIS 2017 intends to con­tribute to chal­lenges and top­ics of Euro­pean Micro– & Nano­elec­tron­ics and to increase vis­i­bil­ity in par­tic­u­lar in the More-​Than-​Moore domain. The nanoFIS 2017 con­fer­ence focuses on imple­men­ta­tion of Key Enabling Tech­nolo­gies for Novel Device Devel­op­ment and High Per­for­mance Sys­tem Integration.

    Keynote Speakers

    • Jo De Boeck – imec (Belgium)
    • Chul-​Hong Kim – LG Dis­play. Co. (Repub­lik of Korea)
    • Fran­cis Balestra – CNRS, IMEP-​LAHC (France)
    • Christofer Hierold – ETH Zürich (Switzerland)
    • Maikke Taklo – SIN­TEF Dig­i­tal (Norway)
    • Got­tfried Strasser – TU Wien (Austria)

    Main Topics

    Sophis­ti­cated sen­sors and devices based on Key Enabling Tech­nolo­gies rang­ing from nan­otech­nol­ogy, micro– and nano­elec­tron­ics to pho­ton­ics, are presently being devel­oped in many R&D labs world­wide for future high-​performance prod­ucts. 3D het­ero­ge­neous inte­gra­tion with CMOS-​technology is the key for prod­uct imple­men­ta­tion of those devices and for real­iz­ing com­plex inte­grated sys­tems with sig­nif­i­cantly advanced func­tion­al­i­ties. This inte­grated sys­tem approach is an essen­tial ele­ment of the More-​than-​Moore Grand Chal­lenge and is expected to cre­ate future busi­ness oppor­tu­ni­ties for Euro­pean semi­con­duc­tor industries.

    Advanced Func­tional Materials

    includ­ing mate­ri­als such as:

    • Nanowires, Car­bon Nan­otubes, Nanorods, Quan­tum Dots & Nanoparticles
    • 2D-​Materials (Graphene, MoS2, MnS2, WS2,…)
    • Elec­tro­ce­ramic and Metal Oxide Materials
    • Organic and flex­i­ble Elec­tronic Materials
    • Pho­tonic Materials

    Nan­ode­vices and Nanosystems

    includ­ing devices and sys­tems such as:

    • Nanowires, Car­bon Nan­otubes and Nanopar­ti­cles based Devices
    • Nanosen­sors and Quan­tum Sensors
    • 2D-​Material based Devices
    • Chem­i­cal and Par­ti­cle Nanosensors
    • Nanores­onators & Nanogenerators
    • Nano Energy Har­vest­ing & Energy Storage
    • Nanopho­tonic Devices
    • MEMS & NEMS Devices
    • Nan­ode­vice Archi­tec­ture & Design

    Sys­tem Inte­gra­tion and Packaging

    includ­ing tech­nolo­gies such as:

    • Het­ero­ge­neous Integration
    • TSV Tech­nolo­gies and TVS based Devices
    • 3D-​Integration, 3D SoC and SiP Solutions
    • Advanced Wafer Bond­ing Tech­nolo­gies (W2W, D2W,…)
    • High Per­for­mance Integration

    Nanoan­a­lyt­ics and Reliability


    • Reli­a­bil­ity Issues of Nano­ma­te­ri­als, Nan­ode­vices and Nanosystems
    • Nanoan­a­lyt­i­cal Meth­ods and Quan­tum Metrology
    • Mate­r­ial Prop­er­ties Char­ac­ter­i­za­tion in nm– and µm-​Scale
    • Advanced Mate­r­ial Mod­el­ling and Simulation
    • Sta­tis­ti­cal Mod­els for short, mid and long term Reli­a­bil­ity Prediction
    • MEMS & NEMS Reli­a­bil­ity Issues

    Smart Man­u­fac­tur­ing Processes

    includ­ing processes such as:

    • Nano­ma­te­ri­als Fab­ri­ca­tion Tech­nolo­gies (Syn­the­sis of Quan­tum Dots, Ther­mal Oxidation,…)
    • New Pat­tern­ing Approaches (NIL, roll-​to-​roll…)
    • Thin Film Depo­si­tion (ALD, Spray Pyrol­y­sis, Ink-​Jetting, Print Transfer,…)
    • (Post-)Processing of Nano­ma­te­ri­als on CMOS devices
    • Back-​end Equip­ment for 3D-​Integration & Packaging

    MCL Poster Awards 2017 & Evening Poster Session

    nanoFIS 2017 Poster Awards are intended to recog­nise out­stand­ing research pre­sented. Awards are granted to the best three poster con­tri­bu­tions (€ 500 for the first, € 400 for the sec­ond and € 300 for the third place).

    Best Posters will be selected by an Inter­na­tional Team and the Awared Cer­e­mony will be held dur­ing the conference.

    Pub­li­ca­tion Opportunity

    Mate­ri­als Today: Pro­ceed­ings

    All con­trib­u­tors have the pos­si­bil­ity to sub­mit a full paper (peer-​review process) which will be pub­lished in “Mate­ri­als Today: Pro­ceed­ings”!

    The Call for Papers will open imme­di­ately after the nanoFIS 2017 con­fer­ence — we will send the rel­e­vant infor­ma­tion to all nanoFIS 2017 con­trib­u­tors! Sub­mis­sion dead­line: will be announced at the conference!

    Con­fer­ence Committee

    Sci­en­tific Chairs

    • Rein­hold Ebner, MCL – Mate­ri­als Cen­ter Leoben Forschung GmbH, Leoben (Austria)
    • Anton Köck, MCL – Mate­ri­als Cen­ter Leoben Forschung GmbH, Leoben (Austria)

    Sci­en­tific Advi­sory Committee

    (in alpha­bet­i­cal order)

    • Nico­lae Barsan – Uni­ver­sity of Tübin­gen, Insti­tute of Phys­i­cal and The­o­ret­i­cal Chem­istry, Tübin­gen (Germany)
    • Emmerich Bertag­nolli – Vienna Uni­ver­sity of Tech­nol­ogy, Insti­tute of Solid State Elec­tron­ics, Vienna (Austria)
    • Stephen Y. Chou – Prince­ton Uni­ver­sity, Depart­ment of Elec­tri­cal Engi­neer­ing, Prince­ton NJ (USA)
    • Silke Chris­tiansen – Max Planck Insti­tute for the Sci­ence of Light, Pho­tonic Nanos­truc­tures, Erlan­gen (Germany)
    • Mart Graef – Delft Uni­ver­sity of Tech­nol­ogy, Fac­ulty of Elec­tri­cal Engi­neer­ing, Delft (The Netherlands)
    • Hos­sam Haick – Tech­nion — Israel Insti­tute of Tech­nol­ogy, Nan­otech­nol­ogy Insti­tute, Haifa (Israel)
    • Paul Hart­mann – Joan­neum Research Forschungs GmbH, Mate­ri­als Research, Weiz (Austria)
    • Christofer Hierold – ETH Zürich, Depart­ment of Mechan­i­cal and Process Engi­neer­ing (Switzerland)
    • Bern­hard Jakoby – Johannes Kepler Uni­ver­sity Linz, ARGE Sen­sorik Aus­tria, Linz (Austria)
    • Jong Min Kim – Uni­ver­sity of Oxford, Depart­ment of Engi­neer­ing Sci­ence, Oxford (United Kingdom)
    • Joachim Krenn – Karl Franzens Uni­ver­sity Graz, Opti­cal Nan­otech­nol­ogy /​Nano-​Optics, Graz (Austria)
    • Jong-​Heun Lee – Korea Uni­ver­sity, Depart­ment of Mate­ri­als Sci­ence and Engi­neer­ing, Seoul (Korea)
    • Charles M. Lieber – Har­vard Uni­ver­stiy, Depart­ment of Chem­istry & Chem­i­cal Biol­ogy, Cam­bridge MA (USA)
    • Chris­t­ian Mit­terer – Mon­ta­nuni­ver­sität Leoben, Phys­i­cal Met­al­lurgy and Mate­ri­als Test­ing, Leoben (Austria)
    • Mervi Paulasto-​Kröckel – Aalto Uni­ver­sity, Elec­tron­ics Inte­gra­tion and Reli­a­bil­ity, Aalto (Finland)
    • Mukhles Sowwan – Oki­nawa Insti­tute of Sci­ence and Tech­nol­ogy, Nanopar­ti­cles by Design (Japan)
    • Florin Udrea – Cam­bridge Uni­ver­sity, Depart­ment of Engi­neer­ing, Cam­bridge (United Kingdom)
    • Zhong Lin Wang – Geor­gia Insti­tute of Tech­nol­ogy, Engi­neer­ing Depart­ment of Mate­ri­als, Atlanta (USA)
    • Roger W. What­more – Impe­r­ial Col­lege Lon­don, Depart­ment of Mate­ri­als, Lon­don (United Kingdom)

    Indus­trial Advi­sory Committee

    (in alpha­bet­i­cal order)

    • Christoph Auer – EPCOS OHG — A Mem­ber of TDK-​EPC Cor­po­ra­tion, Deutsch­lands­berg (Austria)
    • Livio Baldi – Micron Semi­con­duc­tors Italia, Direc­tor, Tech­nol­ogy R&D, Agrate Bri­anza (Italy)
    • Klaus Bern­hardt – FEEI – the Asso­ci­a­tion of the Aus­trian Elec­tri­cal and Elec­tron­ics Indus­tries, Vienna (Austria)
    • Patrick Blouet – STMi­cro­elec­tron­ics, Greno­ble (France)
    • Frank Boschman – Boschman Tech­nolo­gies B.V., Duiven (The Netherlands)
    • Syw­ert Brongersma – Holst Centre/​imec, Eind­hoven (The Netherlands)
    • Simon Deleonibus – CEA, LETI, Research Direc­tor, MINATEC Cam­pus, Greno­ble (France)
    • Max­i­m­il­ian Fleis­cher – Siemens AG, Cor­po­rate Tech­nol­ogy, Munich (Germany)
    • Michael Heuken – AIX­TRON SE, Cor­po­rate Research and Devel­op­ment, Her­zo­gen­rath (Germany)
    • Johann Mas­soner – Infi­neon Tech­nolo­gies Aus­tria AG, Vil­lach (Austria)
    • Ste­fan Raible – ams AG, Busi­ness Line Envi­ron­men­tal Sen­sors, Reut­lin­gen (Germany)
    • Michael Salter – Acreo Swedish ICT AB, Nano­elec­tron­ics Depart­ment, Kista (Sweden)
    • Mar­tin Schrems – ams AG, Process Devel­op­ment & Imple­men­ta­tion, Graz (Austria)
    • Markus Wim­plinger – EV Group, Cor­po­rate Tech­nol­ogy Devel­op­ment, St. Flo­rian (Austria)
    • Chris­t­ian Zenz – NXP Aus­tria GmbH, Pack­ag­ing & Assem­bly, Gratkorn (Austria)

    Organ­is­ing Chair:

    • Mar­git Malatschnig – Techkon­nex – High-​Tech Pro­mo­tion, Vienna (Austria)
    starting: ending: 24.11.2017 Location: , Category:


    Conference START 24.11.2017 END

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