2nd International Conference on Integrated Functional nano Systems (nanoFIS) 2016 Graz

  • Conference Call
  • We have the plea­sure to invite you to the 2nd Inter­na­tional Con­fer­ence nanoFIS 2016 - Inte­grated Func­tional nano Sys­tems! nanoFIS 2016 intends to con­tribute to chal­lenges and top­ics cov­ered by the Mis­sion, Vision & Strat­egy of the Euro­pean Micro– & Nano­elec­tron­ics and to increase vis­i­bil­ity in par­tic­u­lar in the More-​Than-​Moore domain. The nanoFIS 2016 con­fer­ence focuses on imple­men­ta­tion of Key Enabling Tech­nolo­gies for Novel Device Devel­op­ment and 3D Sys­tem Inte­gra­tion. nanoFIS 2016 is jointly organ­ised by the Mate­ri­als Cen­ter Leoben Forschung GmbH and Techkon­nex – High-​Tech Pro­mo­tion on June 2729, 2016 in Graz, Aus­tria.

    Main Top­ics

    Sophis­ti­cated sen­sors and devices based on Key Enabling Tech­nolo­gies rang­ing from nan­otech­nol­ogy, micro– and nano­elec­tron­ics to pho­ton­ics, are presently being devel­oped in many R&D labs world­wide for future high-​performance prod­ucts. 3D het­ero­ge­neous inte­gra­tion with CMOS-​technology is the key for prod­uct imple­men­ta­tion of those devices and for real­iz­ing com­plex inte­grated sys­tems with sig­nif­i­cantly advanced func­tion­al­i­ties. This inte­grated sys­tem approach is an essen­tial ele­ment of the More-​than-​Moore Grand Chal­lenge and is expected to cre­ate future busi­ness oppor­tu­ni­ties for Euro­pean semi­con­duc­tor industries.

    Advanced Func­tion Materials

    includ­ing mate­ri­als such as:

    • Nanowires, Nanorods, Nan­odots & Nanoparticles
    • Graphene and Car­bon Nanotubes
    • Elec­tro­ce­ramic Materials
    • Organic and flex­i­ble Elec­tronic Materials
    • Pho­tonic Materials


    includ­ing sen­sor devices such as:

    • Nanowire and Nanopar­ti­cle based Sensors
    • Chem­i­cal Sen­sors and Par­ti­cle Sensors
    • Graphene & Car­bon Nan­otube based Devices
    • Nanopho­tonic Devices
    • MEMS & NEMS Devices

    Sys­tem Inte­gra­tion and Packaging

    includ­ing tech­nolo­gies such as:

    • 3D Het­ero­ge­neous Integration
    • TSV Tech­nolo­gies and TVS based Devices
    • Advanced Wafer Bond­ing Tech­nolo­gies (W2W, D2W,…)
    • 3D SoC and SiP Solutions


    includ­ing meth­ods such as:

    • Ana­lyt­i­cal Meth­ods for Fail­ure Mode Detection
    • Mate­r­ial Prop­er­ties Char­ac­ter­i­za­tion in nm– and µm-​scale
    • Advanced Mate­r­ial Mod­el­ling and Simulation
    • Crack Prop­a­ga­tion and Thermomechanics
    • Sta­tis­ti­cal Mod­els for short, mid and long term Reli­a­bil­ity Prediction

    Inno­v­a­tive Man­u­fac­tur­ing Process

    includ­ing process tech­nolo­gies such as:

    • Novel Man­u­fac­tur­ing Tech­niques for Nanomaterials
    • New Pat­tern­ing Approaches (NIL, roll-​to-​roll…)
    • Thin Film Depo­si­tion (ALD, ink-​jet,…)
    • Back-​end Equip­ment for 3D packaging

    Pub­li­ca­tion Opportunities

    Con­fer­ence Documentation

    All abstracts will be printed in the con­fer­ence doc­u­ments which you will find enclosed in the del­e­gate bag at the conference.

    Mate­ri­als Today: Proceedings

    All con­trib­u­tors have the pos­si­bil­ity to sub­mit a full paper (peer-​review process) which will be pub­lished in “Mate­ri­als Today: Pro­ceed­ings”.

    Con­fer­ence Committee

    Organ­is­ing Committee

    Sci­en­tific Chairs

    • Rein­hold Ebner, MCL — Mate­ri­als Cen­ter Leoben Forschung GmbH, Leoben (Aus­tria)
    • Anton Köck, MCL — Mate­ri­als Cen­ter Leoben Forschung GmbH, Leoben (Aus­tria)

    Organ­is­ing Chair

    • Mar­git Malatschnig, Techkon­nex – High-​Tech Pro­mo­tion, Vienna (Aus­tria)

    Sci­en­tific Advi­sory Committee

    • Ger­hard Abstre­iter, Tech­nis­che Uni­ver­sität München, Wal­ter Schot­tky Insti­tute, Cen­ter for Nan­otech­nol­ogy and Nano­ma­te­ri­als, Munich (Ger­many)
    • Nico­lae Barsan, Uni­ver­sity of Tübin­gen, Insti­tute of Phys­i­cal and The­o­ret­i­cal Chem­istry, Tübin­gen (Ger­many)
    • Emmerich Bertag­nolli, Vienna Uni­ver­sity of Tech­nol­ogy, Insti­tute of Solid State Elec­tron­ics, Vienna (Aus­tria)
    • Stephen Y. Chou, Prince­ton Uni­ver­sity, Depart­ment of Elec­tri­cal Engi­neer­ing, Prince­ton NJ (USA)
    • Silke Chris­tiansen, Max Planck Insti­tute for the Sci­ence of Light, Pho­tonic Nanos­truc­tures, Erlan­gen (Ger­many)
    • Mart Graef, Delft Uni­ver­sity of Tech­nol­ogy, Fac­ulty of Elec­tri­cal Engi­neer­ing, Delft (The Nether­lands)
    • Hos­sam Haick, Tech­nion — Israel Insti­tute of Tech­nol­ogy, Nan­otech­nol­ogy Insti­tute, Haifa (Israel)
      Paul Hart­mann,
      Joan­neum Research Forschungs GmbH, Mate­ri­als Research, Weiz (Aus­tria)
      Bern­hard Jakoby,
      Johannes Kepler Uni­ver­sity Linz, ARGE Sen­sorik Aus­tria, Linz (Aus­tria)
      Jong Min Kim,
      Uni­ver­sity of Oxford, Depart­ment of Engi­neer­ing Sci­ence, Oxford (United King­dom)
      Joachim Krenn,
      Karl Franzens Uni­ver­sity Graz, Opti­cal Nan­otech­nol­ogy /​Nano-​Optics, Graz (Aus­tria)
    • Jong-​Heun Lee, Korea Uni­ver­sity, Depart­ment of Mate­ri­als Sci­ence and Engi­neer­ing, Seoul (Korea)
    • Charles M. Lieber, Har­vard Uni­ver­stiy, Depart­ment of Chem­istry & Chem­i­cal Biol­ogy, Cam­bridge MA (USA)
      Chris­t­ian Mit­terer,
      Mon­ta­nuni­ver­sität Leoben, Phys­i­cal Met­al­lurgy and Mate­ri­als Test­ing, Leoben (Aus­tria)
    • Mervi Paulasto-​Kröckel, Aalto Uni­ver­sity, Elec­tron­ics Inte­gra­tion and Reli­a­bil­ity, School of Elec­tri­cal Engi­neer­ing, Aalto(Fin­land)
    • Florin Udrea, Cam­bridge Uni­ver­sity, Depart­ment of Engi­neer­ing, Cam­bridge (United King­dom)
    • Zhong Lin Wang, Geor­gia Insti­tute of Tech­nol­ogy, School of Mate­ri­als Sci­ence and Engi­neer­ing Depart­ment of Mate­ri­als, Atlanta (USA)
    • Roger W. What­more, Impe­r­ial Col­lege Lon­don, Depart­ment of Mate­ri­als, Lon­don (United King­dom)

    Indus­trial Advi­sory Committee

    • Christoph Auer, EPCOS OHG — A Mem­ber of TDK-​EPC Cor­po­ra­tion, Deutsch­lands­berg (Aus­tria)
    • Livio Baldi, Micron Semi­con­duc­tors Italia, Direc­tor, Tech­nol­ogy R&D, Agrate Bri­anza (Italy)
    • Klaus Bern­hardt, FEEI – the Asso­ci­a­tion of the Aus­trian Elec­tri­cal and Elec­tron­ics Indus­tries, Vienna (Aus­tria)
    • Patrick Blouet, STMi­cro­elec­tron­ics, Greno­ble (France)
    • Frank Boschman, Boschman Tech­nolo­gies B.V., Duiven (The Nether­lands)
    • Syw­ert Brongersma, Holst Centre/​imec, Eind­hoven (The Nether­lands)
    • Simon Deleonibus, CEA, LETI, Research Direc­tor, MINATEC Cam­pus, Greno­ble (France)
    • Max­i­m­il­ian Fleis­cher, Siemens AG, Cor­po­rate Tech­nol­ogy, Munich (Ger­many)
    • Thomas Gess­ner, Fraun­hofer Insti­tute for Elec­tronic Nano Sys­tems ENAS, Chem­nitz Uni­ver­sity of Tech­nol­ogy, Chem­nitz(Ger­many)
    • Michael Heuken, AIX­TRON SE, Cor­po­rate Research and Devel­op­ment, Her­zo­gen­rath (Ger­many)
    • Johann Mas­soner, Infi­neon Tech­nolo­gies Aus­tria AG, Vil­lach (Aus­tria)
    • Har­ald Okorn-​Schmidt, Lam Research AG, Tech­nol­ogy R & D, Vil­lach (Aus­tria)
    • Ste­fan Raible, Applied­Sen­sor GmbH, CEO, Reut­lin­gen (Ger­many)
    • Michael Salter, Acreo Swedish ICT AB, Nano­elec­tron­ics Depart­ment, Kista (Swe­den)
    • Mar­tin Schrems, ams AG, Process Devel­op­ment & Imple­men­ta­tion, Graz (Aus­tria)
    • Markus Wim­plinger, EV Group, Cor­po­rate Tech­nol­ogy Devel­op­ment, St. Flo­rian (Aus­tria)
    • Chris­t­ian Zenz, NXP Aus­tria GmbH, Pack­ag­ing & Assem­bly, Gratkorn (Aus­tria)
    starting: ending: 29.06.2016 Location: , Category:


    Conference START 29.06.2016 END

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