2012 Hong Kong International Conference on Engineering and Applied Science (HKICEAS)

  • Conference Call
  • The 2012 Hong Kong International Conference on Engineering and Applied Science (HKICEAS 2012) is the main annual Engineering and Applied Science conference aimed at presenting current research being carried out. HKICEAS 2012 will be held during December 14-16, 2012 in Hong Kong and the idea of HKICEAS is for the scientists, scholars, engineers and students from the universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the universities and the industry.

    Conference Topics

    • Biomedical Engineering
    • Chemical Engineering
    • Civil Engineering
    • Computer and Information Sciences
    • Electrical and Electronic Engineering
    • Environmental Science
    • Fundamental and Applied Sciences
    • Geosciences and Petroleum Engineering
    • Material Science and Engineering
    • Mechanical Engineering
    • System and Naval Mechatronic Engineering

    Publication Opportunities

    All accepted papers for the HKICEAS 2012 will be published in the HKICEAS proceedings and will be indexed by WorldCat, Google Scholar, and Engineering & Technology Digital Library, and sent to be reviewed by Ei Compendex and ISI Proceedings.

    Authors of selected papers from HKICEAS 2012 will receive the opportunity to publish their findings in one of the following journals:

    Journal of Neuroscience and Neuroengineering (JNSNE)

    is an international peer-reviewed journal that covers all aspects of neuroscience and neuroengineering. The journal publishes original full-length research papers, letters, tutorials and review papers in all interdisciplinary disciplines that bridge the gaps between neuroscience, neuroengineering, neurotechnology, neurobiology, brain disorders and diseases, novel medicine, neurotoxicology, biomedical engineering and nanotechnology.

    Editors-in-Chief: Dr. Lun-De Liao, Prof. Chin-Teng Lin, Taiwan

    Theoretical and Applied Fracture Mechanics (ISSN: 0167-8442)

    The Mechanics and Physics of Fracture part encourages publication of original research on material damage leading to crack growth and/or fatigue. Materials treated include metal alloys, polymers, composites, rocks, ceramics, etc. The material damage process is complex because it involves the combined effect of loading, size and geometry, temperature and environment.

    Formulation may involve the dissipation of energy in various forms and the identification of microscopic entities and their interactions with macroscopic variables. The advent of the modern computer, however, has offered added capability for analyzing the stresses and/or strain and failure modes. The construction and verification of quantitative theories can be more readily carried out. Encouraged in particular are contributions related to predictions of material damage behavior based on microscopic and/or macroscopic models.

    The Fracture Mechanics Technology section emphasizes material characterization techniques and translation of specimen data to design. Contributions shall cover the application of fracture mechanics to hydro and electric machineries, offshore oil exploration equipment, pipelines and pressure vessels, nuclear reactor components, air, land and sea vehicles, and many others.

    Among the areas to be emphasized are: case histories; material selection and structure design; sample calculations of practical design problems; material characterization procedures; fatigue crack growth and corrosion; nondestructive testing and inspection; code requirements and standards; structural failure and ageing; failure prevention methodologies; maintenance and repair; and product liability and technical insurance.

    Editor-in-Chief: G. Sih, TAFM Editorial Office, East China University of Science and Technology

    starting: ending: 16.12.2012 Location: , Category:


    Conference START 16.12.2012 END

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    Conference Facts

    Location , Address Sky City Rd E 1 Category More Info Conference Website

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