Sophisticated sensors and devices based on Key Enabling Technologies ranging from nanotechnology, micro– and nanoelectronics to photonics, are presently being developed in many R&D labs worldwide for future high-performance products. 3D heterogeneous integration with CMOS-technology is the key for product implementation of those devices and for realizing complex integrated systems with significantly advanced functionalities. This integrated system approach is an essential element of the More-than-Moore Grand Challenge and is expected to create future business opportunities for European semiconductor industries.
nanoFIS 2014 intends to contribute to challenges and topics covered by the Mission, Vision & Strategy of the European Micro– & Nanoelectronics and to increase visibility in particular in the More-Than-Moore domain.
- Jong Min Kim – University of Oxford, Professor of Electrical Engineering, Dept of Engineering Science, Fellow of St. Hughes College, Oxford (United Kingdom): “Future Nano Convergence in IT, ET, and BT“
- Mervi Paulasto-Kröckel – Aalto University, Electronics Integration and Reliability, School of Electrical Engineering, Aalto (Finland): “Design for Reliability for Multi-Materials Systems“
- Lars Samuelson – Lund University, Solid State Physics and the Nanometer Structure Consortium, Lund (Sweden): “Nanowires for Optoelectronics and Energy Applications“
- Zhong Lin Wang – Georgia Institute of Technology, Director of Center for Nanostructure Characterization (CNC), The Hightower Chair in Materials Science and Engineering, College of Engineering Distinguished Professor, Atlanta (USA): “Nanogenerators for self-powered System and Piezotronics for Human-CMOS Interfacing“
- Pascale Maury – ASML (The Netherlands): “Overview of Additive Patterning“
The conference will feature a panel discussion on “Airbus of Chips – Feasible European Reality or Science Fiction?“
Advanced Functional Materials
- Nanowires, Nanorods, Nanodots & Nanoparticles
- Graphene and Carbon Nanotubes
- Electroceramic Materials
- Organic and flexible Electronic Materials
- Photonic Materials
- Nanowire and Nanoparticle based Sensors
- Chemical Sensors and Particle Sensors
- Graphene & Carbon Nanotube based Devices
- Nanophotonic Devices
- MEMS & NEMS Devices
System Integration and Packaging
- 3D Heterogeneous Integration
- TSV Technologies and TVS based Devices
- Advanced Wafer Bonding Technologies (W2W, D2W,…)
- 3D SoC and SiP Solutions
- Analytical Methods for Failure Mode Detection
- Material Properties Characterization in nm– and µm-scale
- Advanced Material Modelling and Simulation
- Crack Propagation and Thermomechanics
- Statistical Models for short, mid and long term Reliability Prediction
Innovative Manufacturing Processes
- Novel Manufacturing Techniques for Nanomaterials
- New Patterning Approaches (NIL, roll-to-roll…)
- Thin Film Deposition (ALD, ink-jet,…)
- Back-end Equipment for 3D packaging
All abstracts will be printed in the conference documents which you will find enclosed in the delegate bag at the conference.
Materials Today: Proceedings
All contributors have the possibility to submit a full paper (peer-review process) which will be published in “Materials Today: Proceedings”!
Materials Today is proud to introduce Materials Today: Proceedings, a new journal dedicated to the publication of research presented at leading scientific conferences spanning the field of materials science, technology and engineering.
Materials Today is a community dedicated to the creation and sharing of materials science knowledge and experience.
Supported by Elsevier, we publish high impact peer-reviewed journals, organize academic conferences, broadcast educational webinars and so much more.
- Margit Malatschnig, Techkonnex – High-Tech Promotion, Vienna (Austria)
- Reinhold Ebner, MCL — Materials Centers Leoben Forschung GmbH, Leoben (Austria)
- Anton Köck, MCL — Materials Centers Leoben Forschung GmbH, Leoben (Austria)
Scientific Advisory Committee
- Gerhard Abstreiter, Technische Universität München, Walter Schottky Institute, Center for Nanotechnology and Nanomaterials, Munich (Germany)
- Emmerich Bertagnolli, Vienna University of Technology, Institute of Solid State Electronics, Vienna (Austria)
- Stephen Y. Chou, Princeton University, Department of Electrical Engineering, Princeton NJ (USA)
- Mart Graef, Delft University of Technology, Faculty of Electrical Engineering, Delft (The Netherlands)
- Hossam Haick, Technion — Israel Institute of Technology, Nanotechnology Institute, Haifa (Israel)
- Paul Hartmann, Joanneum Research Forschungs GmbH, Materials Research, Weiz (Austria)
- Bernhard Jakoby, Johannes Kepler University Linz, ARGE Sensorik Austria, Linz (Austria)
- Jong Min Kim, University of Oxford, Department of Engineering Science, Oxford (United Kingdom)
- Joachim Krenn, Karl Franzens University Graz, Optical Nanotechnology /Nano-Optics, Graz (Austria)
- Charles M. Lieber, Harvard Universtiy, Department of Chemistry & Chemical Biology, Cambridge MA (USA)
- Christian Mitterer, Montanuniversität Leoben, Physical Metallurgy and Materials Testing, Leoben (Austria)
- Florin Udrea, Cambridge University, Department of Engineering, Cambridge (United Kingdom)
- Roger W. Whatmore, Imperial College London, Department of Materials, London (United Kingdom)